CMUDM8001 TR PBFREE

CMUDM8001 SURFACE MOUNT P-CHANNEL ENHANCEMENT-MODE SILICON MOSFET w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMUDM8001 is a P-Channel Enhancement-mode Silicon MOSFET, manufactured by the P-Channel DMOS Process, designed for high speed pulsed amplifier and driver applications. This MOSFET offers Low rDS(ON) and Low Theshold Voltage. MARKING CODE: C8A SOT-523 CASE FEATURES: • Load/Power Switches • Power Supply Converter Circuits • Battery Powered Portable Equipment • • • • • • MAXIMUM RATINGS: (TA=25°C) Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (Steady State) Continuous Drain Current Power Dissipation Operating and Storage Junction Temperature SYMBOL VDS VGS ID ID PD TJ, Tstg APPLICATIONS: Power Dissipation 250mW Low rDS(ON) Low Threshold Voltage Logic Level Compatible Small, SOT-523 Surface Mount Package Complementary Device: CMUDM7001 ELECTRICAL CHARACTERISTICS: (TA=25°C unless SYMBOL TEST CONDITIONS IGSSF, IGSSR VGS=10V, VDS=0 IDSS VDS=20V, VGS=0 BVDSS VGS=0, ID=100μA VGS(th) VDS=VGS, ID=250μA rDS(ON) VGS=4.0V, ID=10mA rDS(ON) VGS=2.5V, ID=10mA rDS(ON) VGS=1.5V, ID=1.0mA Qg(tot) VDS=10V, VGS=4.5V, ID=100mA Qgs VDS=10V, VGS=4.5V, ID=100mA Qgd VDS=10V, VGS=4.5V, ID=100mA gFS VDS=10V, ID=100mA Crss VDS=3.0V, VGS=0, f=1.0MHz Ciss VDS=3.0V, VGS=0, f=1.0MHz Coss VDS=3.0V, VGS=0, f=1.0MHz ton VDD=3.0V, VGS=2.5V, ID=10mA toff VDD=3.0V, VGS=2.5V, ID=10mA 20 10 100 200 250 -65 to +150 otherwise noted) MIN TYP 20 0.6 1.9 2.4 0.658 0.158 0.181 MAX 1.0 1.0 1.1 8.0 12 45 UNITS V V mA mA mW °C UNITS μA μA V V Ω Ω Ω nC 15 45 15 35 nC nC mS pF pF pF ns 80 ns 100 R3 (22-August 2011) CMUDM8001 SURFACE MOUNT P-CHANNEL ENHANCEMENT-MODE SILICON MOSFET SOT-523 CASE - MECHANICAL OUTLINE (Bottom View) LEAD CODE: 1) Gate 2) Source 3) Drain MARKING CODE: C8A R3 (22-August 2011) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)